Thermal pastes matching Dow, Honeywell and Henkel in three months

these TIMs, they're basically thermal based. So if you ever built your own PC, you see the TIM is used in that. It's between the GPU and the cold plate of the system.

Anyway, so it turns out these stems are responsible for 40 % of the total heat resistance for a chip. So basically as heat is making its way out of a chip into the cold plate, 40 %

Mm-hmm.

of the total resistance it faces is from this thermal paste. So it was a great target for us for YC because it's easy to get set up. It's a big problem today. And we can really go build out this whole loop within three months.

with 500 K or YC's money in the bank.

Yeah.

With just these things, you could go after a real industrial problem with it. So yeah, it was great in that sense. The white paper is also all about our approach over there. And interestingly,

Mm.

what we found out was that, so, oh, by the way, so on the customer part. yeah, it was cool

because in three months, we were able to discover these terminal interface materials that are.

on par with what Dow, Honeywell and Henkel are selling today. Dow, Honeywell, Henkel, these guys are like the three big players in the market. They've been making this for over 20 years. They've probably spent millions of dollars of R &D on it. And

Mm.

me and Akash were able to do this in three months out of a garage lab in Oakland, which I thought was super cool.

Kudos for that.

Yeah, all of their materials that they use are also proprietary. they don't like, there aren't even patents on these materials because they don't want anyone to know.

what goes into making them. So I think it was super cool that we were able to do that.

The

one thing we learned while doing this is that I think the approach that's the consensus today is possibly incorrect. The current consensus approach is, we need these self-driving labs, and we need to do everything autonomously, have these closed synthesis loops

Mm.

where people are making materials. However,